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Module family

[MDS/MDC] series

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Characteristic

·Electrical insulation between chip and backplane

·International standard packaging

·Welding structure, excellent temperature characteristics and power cycling capability

·Simple installation, convenient use and maintenance

·Small size and light weight

·The maximum working junction temperature reaches 150 ℃

·Low forward voltage drop

Application

·DC power supply of instruments and equipment

·Input rectifier power supply of PWM inverter

·Battery charging DC power supply

·DC motor excitation power supply

·Input rectification of switching power supply

·Soft start capacitor charging

·Electrical drive and auxiliary current

·Inverter welding machine




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