Module family
Characteristic
·Chip and copper base plate insulation (insulation type)·Chip and copper backplane are not insulated (uninsulated type)
·International standard packaging
·Welding structure, excellent temperature characteristics and power cycling capability
·High mechanical strength and stable rotation speed
·Small size and light weight
·Built in varistor protection
Application
·Brushless generator·DC motor excitation power supply
- Previous：[MTC/MFC] series
- Next：Solid State Series | Solid State Relay